SHANGHAI, May 16, 2022 /PRNewswire/ — To realize full combustion and reduce emissions, the engine of automobile/motorcycle usually requires a temperature pressure sensor on the intake manifold (TMAP) to control the air-fuel ratio quickly and accurately, which can build a balance between power performance, fuel economy and emissions. The automotive absolute pressure sensor with response time in sub-millisecond is one of the key components in combustion engine system to realize closed loop control. There is also the same requirement in the gas-driven models to reduce emission with the pressure sensor near the gas injector.
Semiconductor Supplier NOVOSENSE Microelectronics recently launched its NSPASx series — an automotive-qualified integrated absolute pressure sensor which integrates the automotive-qualified absolute pressure MEMS die(NSP163x) and signal conditioning IC(ASIC). The device adopts ASIC to calibrate and compensate the output of MEMS die, which can convert pressure signals from 10kPa to 400kPa into Vout with a customized output range from 0 to 5V. The internal MEMS die is based on the piezoresistive effect of high-sensitivity monocrystalline silicon and is designed with advanced silicon-silicon bonding CSOI MEMS micromachining technology which has been certified by IAFTF16949. The whole wafer has 100% passed AOI and CP test and also the AEC-Q103 qualification, total accuracy is less than ±1%FS during its life cycle.
The NSPASx series and MEMS wafer(NSP163x) are mainly used in intake manifold pressure detection of vehicle/motorcycle, purging line pressure detection of vehicle, vacuum boosting system (VBS) pressure detection of HEV/EV, thermal runaway pressure detection of battery pack, as well as the car seat airbag pressure detection.
Key features:
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High accuracy and low power consumption:
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Multiple output modes with good portability for various applications:
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Automobile-level standard with high reliability and stability:
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Quick response to control the ratio of air-fuel speedily:
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Customization for different applications with high flexibility:
NOVOSENSE Microelectronics has self-developed MEMS/ASIC, packaging technology and automatic calibration technology at multi-pressure and multi-temperature points, which can support MEMS wafer and integrated device customization to meet the requirements in multi-applications.
For sample application or order, please email to [email protected]
Type |
GPN |
Pressure Range |
Output |
Accuracy |
Vin |
Temp |
Package |
Absolute |
NSPAS3 Series |
10kPa~400kPa |
0.5V~4.5V |
1%(0~85℃) |
5V |
-40℃~130℃ |
SOP-8 7.0mm x 7.0mm |
Absolute |
NSPAS1 Series |
10kPa~400kPa |
0.5V~4.5V |
1%(0~85℃) |
5V |
-40℃~125℃ |
SOP-8 7.3mm x 7.3mm |
About NOVOSENSE:
NOVOSENSE is a high performance and high reliability analog and mixed signal chip design company in China. Focusing on Sensing, Driving and System Interconnection, NOVOSENSE provides comprehensive semiconductor products and solutions such as sensors, signal chain, isolator & interface, power device & driver, as well as power management, which are widely used in automotive, industrial control, information communication and consumer electronics.
With the mission of “Sense and Drive the Future, Build a Connected World with Semiconductors”, the company is committed to providing chip level solutions for the connection between the digital and the real world.
For more information, please visit website: www.novosns.com
SOURCE NOVOSENSE Microelectronics
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